Tungsten layers are components of thin-film transistors in TFT-LCD screens. They are used when large screen formats, a particularly high image definition, and optimized contrasts are required. Tungsten targets are also used in microelectronics, for example for creating layers in frequency filters (SAW/surface acoustic wave filter, BAW/bulk acoustic wave filter). Other applications for tungsten targets include diffusion barriers made of tungsten-nitride, conductor tracks in microelectronic components as well as reactively sputtered transparent layers made from tungsten oxide for OLED displays and for use in electrochemistry.
High purity
> 99.97%
Maximum density
> 99.5%
Center of expertise for new coating solutions
Homogeneous microstructure
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During the magnetron sputtering process (PVD process), tiny metal particles are released from the sputtering targets, which settle as a thin film on the material - the so-called substrate - to be coated. This coating process is a cost-effective and fast coating process in which all materials must satisfy the most stringent quality criteria.
Our targets fulfill the most stringent purity requirements. The main advantages: excellent electrical conductivity of the layer and minimum particle formation during the PVD process. Metal and non-metal impurities in the sputtering target are transferred to the sputtered functional layer, thereby affecting its function or causing particle formation in the PVD process (the so-called arcing effect). We guarantee that our tungsten targets are at least 99.97% pure. The typical purity of our tungsten targets is even higher at 99.99%. This is how we guarantee that the layers produced satisfy the stringent requirements particularly for use in microelectronics.
Tungsten sputtering targets from Plansee are highly compressed by means of special forming processes. The advantage for the PVD coating process is homogeneous coating rates and improved coating properties. This results in improved efficiency and output in the production of thin films. Our powder metallurgical manufacturing process enables us to adjust the microstructure of the coating material to the specific application.
In the PVD process, everything must be perfectly matched. It is only if all process parameters are perfectly matched that the layer that meets the exact customer-specific requirements can be produced. We carry out sputtering under practical conditions in our PVD application laboratory. Our team of developers produces layers and analyzes them in detail according to defined specifications. New coating materials are developed in a short period of time in cooperation with our customers and numerous development partners. Having worked with system manufacturers and OEMs for several years, we are directly involved in the latest developments and optimizations.
We house the entire value-added chain for our sputtering targets under one roof. From the raw material to the final product. Our in-house production encompasses both the development of new materials and the optimization of layers and coating processes. Sintering is the central process in our powder metallurgical manufacturing process. This is how we manufacture compact metal products from porous powder blanks. We produce tungsten planar targets in the world's largest hot-rolling mill for refractory metals. Following the machining process, we finalize the sputtering targets ready for installation in our local bonding shops.
Our customers have been relying on Plansee as an independent private company for an entire century. Reliability and continuity are just as important to us as they are to you. Especially when it comes to our raw material supply. With Global Tungsten & Powders and a shareholding in Molibdenos y Metales (Molymet), the Plansee Group covers all of the steps involved in tungsten and molybdenum processing. From producing the powder to powder metallurgical processes, all the way through the production of semifinished products and customer-specific components.
Molybdenum sputtering targets
Molybdenum sputtering targets/rotary targets
Molybdenum-sodium sputtering targets
Molybdenum-niobium sputtering targets
Molybdenum oxide sputtering targets
Molybdenum-tantalum sputtering targets
Molybdenum-tungsten sputtering targets
Tungsten-nickel sputtering targets
Tungsten-titanium sputtering targets
